Teardown of a PC power supply

Have you ever wondered what's inside your computer's power supply? The task of a PC power supply is to convert the power from the wall (120 or 240 volts AC) into stable power at the DC voltages that the computer requires. The power supply must be compact and low-cost while transforming the power efficiently and safely. To achieve these goals, power supplies use a variety of techniques and are more complex inside than you might expect. In this blog post, I tear down a PC power supply and explain how it works.1

The power supply I examined, like most modern power supplies uses a design known as a "switching power supply." Switching power supplies are now very cheap, but this wasn't always the case. In the 1950s, switching power supplies were complex and expensive, used in aerospace and satellite applications that needed small, lightweight power supplies. By the early 1970s, though, new high-voltage transistors and other technology improvements made switching power supplies much cheaper and they became widely used in computers. Now, you can buy a phone charger for a few dollars that contains a switching power supply.

The ATX power supply that I examined was packaged in a metal box the size of a brick, with a remarkable number of colorful cables emerging from it. Removing the case reveals the components below, tightly packed to keep the power supply compact. Many of the components are hidden by the heat sinks that keep the power semiconductors cool along with the fan at the right.

The power supply, removed from the case. The large bundle of wires at the left is connected to the computer. The large component in the middle that looks like a transformer is a filter inductor. Click this photo (or any other) for a larger version.

I'll start with a quick overview of how the switching power supply works, and then describe the components in detail. Starting at the right, the power supply receives AC power. The input AC is converted to high-voltage DC, with the help of some large filtering components. This DC is switched on and off thousands of times a second to produce pulses that are fed into a transformer, which converts the high-voltage pulses into low-voltage, high-current pulses. These pulses are converted to DC and filtered to provide nice, clean power, which is fed to the computer's motherboard and disk drives through the bundle of wires on the left.

While this process may seem excessively complex, most consumer electronics, from your cell phone to your television, use a switching power supply. The high frequencies allow the use of a small, lightweight transformer. In addition, switching power supplies are very efficient; the pulses are adjusted to supply just the power needed, rather than turning excess power into waste heat as in a "linear" power supply.

Input filtering

The first step is for the input AC to go through an input filter circuit that blocks electrical noise from exiting the power supply. The filter below consists of inductors (the toroidal coils) and capacitors. These boxy gray capacitors are special Class-X capacitors, designed to be connected safely across the AC lines.

The input filter components

Rectification: converting AC to DC

The 60-Hertz AC (alternating current) from the wall oscillates 60 times a second, but the power supply needs steady DC (direct current) that flows in one direction. The full-bridge rectifier below converts the AC to DC. The rectifier below is marked with "-" and "+" for the DC outputs, while the two center pins are the AC input. Internally the rectifier contains four diodes. A diode allows current to pass in one direction and blocks it in the other direction, so the result is that the alternating current is converted to direct current, flowing in the desired direction.

The bridge rectifier is labeled "GBU606". Filter circuitry is to its left. To the right, the large black cylinder is one of the voltage-doubler capacitors. The small yellow capacitor is a special Y capacitor, designed for safety.

The diagram below shows how the bridge rectifier works. In the first schematic, the AC input has the upper side positive. The diodes pass the voltage through to the DC output. In the second schematic, the AC input has reversed direction. However, the configuration of the diodes ensures that the DC output voltage stays the same (positive on top). The capacitors smooth out the output.

The two schematics show the flow of current as the AC input oscillates. The diodes force current to flow in the direction indicated by their arrow shape.

Modern power supplies accept a "universal" input voltage of 85 to 264 volts AC, so they are usable in different countries regardless of the country's voltage. However, the circuitry of this older power supply couldn't handle such a wide input range. Instead, you had to flip a switch (below) to select between 115 V and 230 V.

The 115/230 V switch.

The voltage selection switch used a clever circuit, a voltage doubler. The idea is that with the switch closed (for 115 volts), the AC input bypasses the bottom two diodes in the bridge rectifier and is instead connected directly to the two capacitors. When the AC input is positive on top, the top capacitor is charged with the full voltage. And when the AC input is positive on the bottom, the lower capacitor is charged with the full voltage. Since the DC output is across both capacitors, the DC output has double the voltage. The point of this is that the rest of the power supply receives the same voltage, whether the input is 115 volts or 230 volts, simplifying its design. The downsides of the voltage doubler are that the user must put the switch in the correct position (or risk destroying the power supply), and the power supply requires two large capacitors. For these reasons, the voltage doubler has gone out of style in more recent power supplies.

The voltage doubler circuit. Each capacitor is charged with the full voltage, so the DC output has double the voltage. The grayed-out diodes are not used when the doubler is active.

Primary and secondary

For safety, the high-voltage components and the low-voltage components are separated, both mechanically and electrically. The primary side below contains all the circuitry that is connected to the AC line. The secondary side contains the low-voltage circuitry. The primary and secondary are separated by an "isolation boundary" (shown in green), with no electrical connections across the boundary. The transformers pass power across this boundary through magnetic fields, without a direct electrical connection. Feedback signals are sent from the secondary to the primary by opto-isolators, which transmit signals optically. This separation is a key factor in safe power supply design: a direct electrical connection between the AC line and the output would create a high danger of electric shock.

The power supply with main features labeled. The heat sinks, capacitors, control board, and output wires have been removed to give a better view. (SB indicates the standby supply.)

Pulses to the transformer

At this point, the input AC has been converted to high-voltage DC, about 320 volts.2 The DC is chopped into pulses by the switching transistor above, a power MOSFET.3 Because this transistor gets hot during use, it was mounted on a large heat sink. These pulses are fed into the main transformer above, which in a sense is the heart of the power supply.

The transformer consists of multiple coils of wire wound around a magnetizable core. The high-voltage pulses into the transformer's primary winding produce a magnetic field. The core directs this magnetic field to the other, secondary windings, producing voltages in these windings. This is how the power supply safely produces its output voltages: there is no electrical connection between the two sides of the transformer, just a connection by the magnetic field. The other important aspect of the transformer is that the primary winding has the wire wrapped around the core a large number of times, while the secondary windings are wrapped around a much smaller number of times. The result is a step-down transformer: the output voltage is much smaller than the input, but at a much higher current.

The switching transistor3 is controlled by an integrated circuit, a "UC3842B current mode PWM controller". This chip can be considered the brains of the power supply. It generates pulses at the high frequency of 250 kilohertz. The width of each pulse is adjusted to provide the necessary output voltage: if the voltage starts to drop, the chip produces wider pulses to pass more power through the transformer.4

The secondary side

Now we can look at the secondary side of the power supply, which receives the low-voltage outputs from the transformer. The secondary circuitry produces the four output voltages: 5 volts, 12 volts, -12 volts, and 3.3 volts. Each output voltage has a separate transformer winding and a separate circuit to produce that voltage. Power diodes (below) convert the outputs from the transformer to DC, and then inductors and capacitors filter the output to keep it smooth. The power supply must regulate the output voltages to keep them at the proper level even as the load increases or decreases. Interestingly, the power supply uses several different regulation techniques.

Closeup of the output diodes. At the left are cylindrical diodes mounted vertically. In the middle are pairs of rectangular power Schottky diodes; each package holds two diodes. These diodes were attached to a heat sink for cooling. At right note the two staple-shaped copper wires used as current-sensing resistors.

The main outputs are the 5-volt and 12-volt outputs. These are regulated together by the controller chip on the primary side. If the voltage is too low, the controller chip increases the width of the pulses, passing more power through the transformer and causing the voltage on the secondary side to increase. And if the voltage is too high, the chip decreases the pulse width. (The same feedback circuit controls both the 5-volt and 12-volt output, so the load on one output can affect the voltage on the other. Better power supplies regulate the two outputs separately.5)

Underside of the power supply, showing the printed circuit board traces. Note that wide separation between the secondary-side traces on the left and the primary-side traces on the right. Also note the wide metal traces used for the high-current supply and the thin traces for control circuitry.

You might wonder how the controller chip on the primary side receives feedback about the voltage levels on the secondary side, since there is no electrical connection between the two sides. (In the photo above, you can see the wide gap separating the two sides.) The trick is a clever chip called the opto-isolator. Internally, one side of the chip contains an infra-red LED. The other side of the chip contains a light-sensitive photo-transistor. The feedback signal on the secondary side is sent into the LED, and the signal is detected by the photo-transistor on the primary side. Thus, the opto-isolator provides a bridge between the secondary side and the primary side, communicating by light instead of electricity.6

The power supply also provides a negative voltage output (-12 V). This voltage is mostly obsolete, but was used to power serial ports and PCI slots. Regulation of the -12 V supply is completely different from the 5-volt and 12-volt regulation. The -12V output is controlled by a Zener diode, a special type of diode that blocks reverse voltage until a particular voltage is reached, and then starts conducting. The excess voltage is dissipated as heat through a power resistor (pink), controlled by a transistor and the Zener diode. (Since this approach wastes energy, modern high-efficiency power supplies don't use this regulation technique.)

The -12 V supply is regulated by a tiny Zener diode "ZD6", about 3.6 mm long, on the underside of the circuit board. The associated power resistor and transistor "A1015" are on the top side of the board.

Perhaps the most interesting regulation circuit is for the 3.3-volt output, which is regulated by a magnetic amplifier. A magnetic amplifier is an inductor with special magnetic properties that make it behave like a switch. When a current is fed into the magnetic amplifier inductor, at first the inductor will almost completely block the current as the inductor magnetizes and the magnetic field increases. When the inductor reaches its full magnetization (i.e. it saturates), the behavior suddenly changes and the inductor lets the current flow unimpeded. In the power supply, the magnetic amplifier receives pulses from the transformer. The inductor blocks a variable part of the pulse; by changing the pulse width, the 3.3-volt output is regulated.7

The magnetic amplifier is a ring constructed from ferrite material with special magnetic properties. The ring has a few turns of wire wound around it.

The control board

The power supply has a small board holding the control circuitry. This board compares the voltages against a reference to generate the feedback signals. It also monitors the voltages to generate a "power good" signal.8 This circuitry is mounted on a separate, perpendicular board so it doesn't take up much room in the power supply.

The control board has through-hole components on top and the underside is covered with tiny surface-mount components. Note the "zero-ohm" resistors marked with 0, used as jumpers.

The standby power supply

The power supply contains a second circuit for standby power.9 Even when the computer is supposedly turned off, the 5V standby supply is providing 10 watts. This power is used for features that need to be powered when the computer is "off", such as the real-time clock, the power button, and powering-on via the network ("Wake on LAN"). The standby power circuit is almost a second independent power supply: it uses a separate control IC, separate transformer, and components on the secondary side, although it uses the same AC-to-DC circuitry on the primary side. The standby power circuit provides much less power than the main circuit, so it can use a smaller transformer.

The black and yellow transformers: the transformer for standby power is on the left and the main transformer is on the right. The control IC for standby power is in front of the transformer. The large cylindrical capacitor on the right is part of the voltage doubler. The white blobs are silicone to insulate components and hold them in place.

Conclusion

An ATX power supply is complex internally, with a multitude of components ranging from chunky inductors and capacitors to tiny surface-mount devices.10 This complexity, however, results in power supplies that are efficient, lightweight, and safe. In comparison, I wrote about a power supply from the 1940s that produced just 85 Watts DC, but was suitcase-sized and weighed over 100 pounds. Now, with advanced semiconductors, you can hold a much more powerful power supply for under $50 that you can hold in your hand.

I've written about power supplies before, including a history of power supplies in IEEE Spectrum. You might also like my Macbook charger teardown and iPhone charger teardown. I announce my latest blog posts on Twitter, so follow me at kenshirriff. I also have an RSS feed.

Notes and references

1. Intel introduced the ATX standard for personal computers in 1995. The ATX standard (with some updates) still defines the motherboard, enclosure, and power supply configuration for most PCs. The power supply I examined is from 2005, so newer power supplies are more advanced and more efficient. The basic principles are the same, but there are some changes. For instance, regulation using DC-to-DC converters has mostly replaced the magnetic amplifier.

   

   The label on the power supply.

   The label provides information about the power supply I examined. It was built by Bestec for Hewlett-Packard's Dx5150 desktop PC. This power supply doesn't fit the ATX dimensions; it is longer and more rectangular. ↩

2. You might wonder why an AC input of 230 volts yields 320 volts DC. The reason is that AC voltage is normally measured as root-mean-square which (sort of) averages the varying waveform. As a result, a 230-volt AC signal has peaks of 320 volts. The power supply capacitors charge through the diodes to the peak voltage, so the DC will be approximately 320 volts (although it will sag somewhat through the cycle). ↩

3. The power transistor is an FQA9N90C power MOSFET. It can handle 9 amps and 900 volts. ↩↩

4. The integrated circuit is powered by a separate winding on the transformer that provides 34 volts to run the chip. You might notice a chicken-and-egg problem: the control IC creates the pulses to the transformer, but the transformer powers the control IC. The solution is a startup circuit consisting of a 100 kΩ resistor between the IC and the high-voltage DC. This provides a small current, sufficient to start operation of the IC. Once the IC starts sending pulses to the transformer, it is powered by the transformer. ↩

5. The technique of using one regulation loop for two outputs is called cross-regulation. If the load on one output is much higher than the load on the other, the voltages may diverge from their proper values. For this reason, many power supplies have a minimum load requirement on each output. More advanced power supplies use DC-to-DC converters for all the outputs to make sure they are precise. For more about cross-regulation, see this presentation and this presentation. One technique discussed is DC-stacking the output windings, a technique used in this power supply. Specifically, the 12-volt output is implemented as a 7-volt output "stacked" on top of the 5-volt output, yielding 12-volts. With this configuration, a 10% error (for example) in the 12-volt circuit would be just 0.7 V rather than 1.2 V. ↩

6. The opto-isolators are PC817 components, which provide 5000 volts of isolation between the two sides. Note the slot cut in the circuit board underneath the opto-isolators. This provides additional safety, ensuring that dangerous voltages cannot pass between the two sides of the opto-isolator along the surface of the circuit board, for example if there were contamination or condensation on the board. (Specifically, the slot increases the creepage distance.) ↩

7. The pulse width through the magnetic amplifier is set by a simple control circuit. During the reverse part of each pulse, the inductor is partially demagnetized. A control circuit adjusts the demagnetization voltage. A higher demagnetization voltage produces more demagnetization. This causes the inductor to take longer to re-magnetize and thus it blocks the input pulse for a longer time. With a shorter pulse passing through the circuit, the output voltage is decreased. Conversely, a lower demagnetization voltage produces less demagnetization, so the input pulse is blocked for a shorter time. Thus, the output voltage is regulated by changing the demagnetization voltage. Note that the pulse width into the magnetic amplifier is controlled by the control IC; the magnetic amplifier cuts these pulses shorter as needed to regulate the 3.3 V output. ↩

8. The control board contains multiple ICs including an LM358NA op-amp, a TPS3510P supervisor/reset chip, an LM339N quad differential comparator, and an AZ431 precision reference. The supervisor chip is interesting; it is specifically designed for power supplies and monitors the outputs to make sure they are not too high or too low. The AZ431 is a variant of the TL431 bandgap reference chip, which is very commonly used in power supplies to provide a reference voltage. I've written about the TL431 here. ↩

9. The standby power supply uses a different transformer configuration, called a flyback transformer. The control IC is an A6151, which includes the switching transistor in the IC, simplifying the design.

   

   Power supply circuit using the A6151. This schematic is from the datasheet so it is close to the circuit in the power supply I examined, but not identical.

    ↩

10. If you want to see detailed schematics of a variety of ATX power supplies, see danyk.cz. It's remarkable how many different implementations are used in power supplies: different topologies (half-bridge or forward), absence or presence of power factor conversion (PFC), and different control, regulation, and monitoring systems. The power supply I examined is moderately similar to the forward topology ATX supplies without PFC near the bottom of the page. ↩

Inside the 8086 processor, tiny charge pumps create a negative voltage

Introduced in 1978, the revolutionary Intel 8086 microprocessor led to the x86 processors used in most desktop and server computing today. This chip is built from digital circuits, as you would expect. However, it also has analog circuits: charge pumps that turn the 8086's 5-volt supply into a negative voltage to improve performance.1 I've been reverse-engineering the 8086 from die photos, and in this post I discuss the construction of these charge pumps and how they work.

Die photo of the 8086 microprocessor. The ALU and registers are on the left. The microcode ROM is in the lower right. Click for a high-resolution image.

The photo above shows the tiny silicon die of the 8086 processor under a microscope. The metal layer on top of the chip is visible, with the silicon hidden underneath. Around the outside edge, bond wires connect pads on the die to the chip's 40 external pins. However, careful examination shows that the die has 42 bond pads, not 40. Why are there two extra ones?

An integrated circuit starts with a silicon substrate, and transistors are built on this. For high-performance integrated circuits, it is beneficial to apply a negative "bias" voltage to the substrate. 2 To obtain this substrate bias voltage, many chips in the 1970s had an external pin that was connected to -5V,3 but this additional power supply was inconvenient for the engineers using these chips. By the end of the 1970s, however, on-chip "charge pump" circuits were designed that generated the negative voltage internally. These chips used a single convenient +5V supply, making engineers happier.

A closeup of the 8086 chip showing the silicon die and the bond wires connecting it to the lead frame.

On the 8086 die, the two extra pads feed this negative bias voltage to the substrate. The photo above shows the silicon die as mounted in the chip, with bond wires connected to the lead frame that forms the pins. Looking carefully, there are two small gray squares above and below the die; each connected to one of the "extra" bond pads. The charge pumps on the 8086 die generate a negative voltage, which passes through the bond wires to these squares, and then through the metal plate underneath to the 8086's substrate.

How the charge pumps work

The photo below highlights the two charge pumps in the 8086. I'll discuss the top one; the bottom one has the same circuitry but a different layout to fit in the available space. Each pump has driver circuitry, a large capacitor, and a pad with the bond wire to the substrate. Each pump is located next to one of the 8086's two ground pads, presumably to minimize electrical noise.

Die photo of the 8086 microprocessor, zooming in on the two substrate bias generators.

You might wonder how a charge pump can turn a positive voltage into a negative voltage. The trick is a "flying" capacitor, as shown below. On the left, the capacitor is charged to 5 volts. Now, disconnect the capacitor and connect the positive side to ground. The capacitor still has its 5-volt charge, so now the low side must be at -5 volts. By rapidly switching the capacitor between the two states, the charge pump produces a negative voltage.

On the left, the "flying capacitor' is charged to 5 volts. By switching ground to the upper terminal, the capacitor now outputs -5 volts. (source)

The 8086's charge pump circuit uses MOSFET transistors and diodes to switch the capacitor between the two states, with an oscillator to control the transistors, as shown in the schematic below. The ring oscillator consists of three inverters connected in a loop (or ring). Because the number of inverters is odd, the system is unstable and will oscillate.5 For instance, if the input to the first inverter is 0, its output will be 1, the second output will be 0, and the third output will be 1. This will flip the first inverter, and the "flip" will travel through the loop causing oscillation. To slow down the oscillation rate, two resistor-capacitor networks are inserted into the ring. Since the capacitors will take some time to charge and discharge, the oscillations will be slowed, giving the charge pump time to operate.4

Schematic of the charge pump used in the Intel 8086 to provide negative substrate bias.

The outputs from the ring oscillator are fed to the transistors that drive the capacitor. In the first step, the upper transistor is switched on, causing the capacitor to charge through the first diode to 5 volts with respect to ground. The second step is where the magic happens. The lower transistor turns on, connecting the high side of the capacitor to ground. Since the capacitor is still charged to 5 volts, the low side of the capacitor must now be at -5 volts, producing the desired negative voltage. This goes through the second diode and the bond wire to the substrate. When the oscillator flips again, the upper transistor turns on and the cycle repeats. The charge pump gets its name because it pumps charge from the output to ground.6 The diodes are similar to check valves in a water pump, making sure charge moves in the right direction.

The implementation in silicon

The photo below shows the charge pump as it is implemented on the chip. In this photo, the metal wiring is visible on top, with reddish polysilicon underneath and beige silicon at the bottom. The main capacitor is visible in the center, with H-shaped wiring connecting it to the circuitry on the left. (Part of the capacitor is hidden under the wide metal power trace at the top.) On the right, the substrate bond wire is attached to the pad. A test pattern is below the pad; it has a square for each mask used to produce a layer of the chip.

The charge pump, showing the metal layer.

Removing the metal layer shows the circuitry more clearly, below. The large charge pump capacitor takes up the right half of the photo. Although microscopic, this capacitor is huge by chip standards, about the size of a 16-bit register. The capacitor consists of polysilicon over a silicon region, separated by insulating oxide; the polysilicon and silicon form the plates of the capacitor. On the left side are the smaller capacitors and the resistors that provide the R-C delay for the oscillator. Below them is the oscillator circuitry and the drive transistors.7

An 8086 charge pump, showing the key components. The metal has been removed for this photo, to show the silicon and polysilicon underneath.

One interesting feature of the charge pump is the two diodes, each built from eight transistors in a regular pattern. The diagram below shows the structure of a transistor. Regions of the silicon are doped with impurities to create diffusion regions with desired properties. The transistor can be viewed as a switch, allowing current to flow between two diffusion regions called the source and drain. The transistor is controlled by the gate, made of a special type of silicon called polysilicon. A high voltage on the gate lets current flow between the source and drain, while a low voltage blocks current flow. These tiny transistors can be combined to form logic gates, the components of microprocessors and other digital chips. But in this case, the transistors are used as diodes.

Structure of an NMOS transistor (MOSFET) as implemented in an integrated circuit.

The photo below shows a transistor in the charge pump, viewed from above. As in the diagram, polysilicon forms the gate between the silicon diffusion regions on either side. A diode can be formed from a MOSFET by connecting the gate and drain together (details) through the silicon/polysilicon connection at the bottom of the photo. The silicon can also be connected to the metal layer through a "via". The metal layer was removed for this photo, but faint circles indicate the position of silicon/metal vias.

A transistor in the charge pump circuit. The polysilicon gate separates the transistor's source and drain on either side.

The diagram below shows how the two diodes are implemented from 16 transistors. To support the relatively high current of the charge pump, eight transistors are used in parallel for each diode. Note that neighboring transistors share source or drain regions, allowing transistors to be packed densely. The blue lines indicate the metal wires; the metal was removed for this photo. The dark circles indicate connections (vias) between the metal and silicon.

The charge pump has two diodes, each implemented with 8 transistors. The source, gate, and drain are indicated with S, G, and D.

Putting this all together, the upper eight transistors have their sources connected to ground by a metal wire. Their gates and drains connected together by the polysilicon below the transistors, making them into diodes, and they are connected to the capacitor by a metal wire. The lower eight transistors form a second diode; their gates and drains are wired together by the lower metal wire loop. Note how the layout has been optimized; for example, the gates have bent shapes to avoid the vias (black dots).

Conclusions

The substrate bias generator on the 8086 chip9 is an interesting combination of digital circuitry (a ring oscillator formed from inverters) and an analog charge pump. While the bias generator may seem like an obscure part of 1970s computer history, bias generation is still part of modern integrated circuits. It is much more complex in modern chips which have multiple carefully regulated biases in multiple power domains. 8 In a sense it is analogous to the x86 architecture, something that started in the 1970s and is even more popular today, but has become unimaginably more complex in the quest for higher performance.

If you're interested in the 8086, I wrote about the 8086 die, its die shrink process and the 8086 registers earlier. I plan to analyze the 8086 in more detail in future blog posts so follow me on Twitter @kenshirriff or RSS for updates.

Notes and references

1. Strictly speaking, the entire chip is analog: there's an old saying that "Digital computers are made from analog parts". This saying came from DEC engineer Don Vonada and was published in DEC's Computer Engineering in 1978.

   

   Vonada's Engineering Maxims (text).

    ↩

2. Putting a negative bias voltage on the substrate had several benefits. It decreased parasitic capacitance making the chip faster, made the transistor threshold voltage more predictable, and reduced leakage current. ↩

3. Early DRAM memory chips and microprocessor chips often required three supplies: +5V (Vcc), +12V (Vdd) and -5V (Vbb) bias voltage. In the late 1970s, improvements in chip technology allowed a single supply to be used instead. For example, Mostek's MK4116 (a 16 kilobit DRAM from 1977) required three voltages while the improved MK4516 (1981) operated on a single +5V supply, simplifying hardware designs. (Amusingly, some of these chips still kept the Vbb and Vcc pins for backward compatibility but left them unconnected.) Intel's memory chips followed a similar path, with the 2116 DRAM (16K, 1977) using three voltages and the improved 2118 (1979) using a single voltage. Similarly, the famous Intel 8080 microprocessor (1974) used enhancement-mode transistors and required three voltages. An improved version, the 8085 (1976), used depletion-mode transistors and was powered by a single +5V supply. The Motorola 6800 microprocessor (1974) used a different approach for a single supply; although the 6800 was built from the older enhancement-load transistors it avoided the +12 supply by implementing an on-chip voltage doubler, a charge pump that increased the voltage. ↩

4. I tried to measure the frequency of the charge pump by looking at the chip's current to see fluctuations due to the charge pump. I measured 90 MHz fluctuations, but I suspect I was measuring noise and not the charge pump's oscillations. ↩

5. Because the circuit has an odd number of inverters, it oscillates. If, on the other hand, it had an even number of inverters, it would be stable in two different states. This technique is used in the 8086's registers: a pair of inverters stores each bit (details). ↩

6. I've simplified the charge pump discussion slightly. Due to voltage drops in the transistors, the substrate voltage will probably be around -3V, not -5V. (If a chip requires a larger voltage drop, charge pump stages can be cascaded.) For the pump direction, I'm referring to current flow. If you think of it as pumping electrons, the negative electrons are being pumped the opposite direction, into the substrate. ↩

7. The oscillator is built from 13 transistors. Seven transistors form the 3 inverters (one inverter has an extra transistor to provide extra output current. The six drive transistors consist of two transistors pulling the output high and four transistors pulling the output low. The layout is strangely different from normal inverter circuitry, probably because the current requirements are different from normal digital logic. ↩

8. Bias generators are now available as IP blocks that can be licensed and be plugged into a chip design. For more information on bias in modern chips, see Body bias, Multi bias domain implementation, or this presentation. There is even a standard IEEE 1801 power format that allows IC design tools to generate the necessary circuitry. ↩

9. The Intel 8087, the math coprocessor chip that goes along with the 8086, also has a substrate bias generator. It uses the same principles, but unexpectedly has a different circuit, using 5 inverters. I wrote about it in detail here. ↩

Tiny transformer inside: Decapping an isolated power transfer chip

I saw an ad for a tiny chip1 that provides 5 volts2 of isolated power: You feed 5 volts in one side, and get 5 volts out the other side. What makes this remarkable is that the two sides can have up to 5000 volts between them. This chip contains a DC-DC converter and a tiny isolation transformer so there's no direct electrical connection from one side to the other. I was amazed that they could fit all this into a package smaller than your fingernail, so I decided to take a look inside.

I obtained a sample chip from Texas Instruments. Robert Baruch of project5474 decapped this chip for me by boiling it in sulfuric acid at 210 °C. This dissolved the epoxy package, leaving a pile of tiny components, shown below with a penny for scale. At the top are two tiny silicon dies, one for the primary circuitry and one for the secondary. Below the dies are two magnetized ferrite plates from the transformer. To the right is one of five pieces of woven glass fiber. At the bottom is a copper heat sink, partially dissolved by the decapping process.3

Components of the chip, on a penny for scale.

The chip also contained two octagonal copper coils that were the transformer windings. The photo below shows the remnants of one coil after decapping. These windings were probably copper traces on tiny printed circuit boards; the pieces of woven glass fiber are the remnants of these boards after the epoxy was dissolved. It appears that the winding consisted of multiple wires in parallel, rather than a coiled wire.

An octagonal transformer winding.

To determine how the components went together, I studied Texas Instruments patents and found a similar power isolation chip (below). Note the structure of the two dies and the coils. A key feature of this patent is the leads are raised internally, with the dies mounted upside down. This provides better electromagnetic isolation from the circuit board.

Diagram from a Texas Instruments patent, showing the structure of a power isolation chip.

The chip is in a SOIC package, smaller than a fingernail. The mockup image below shows that the silicon dies and the transformer winding are so small that they can fit in this package.4 This power chip is about twice as thick as a standard SOIC package so it can hold the multiple layers of the transformer.`

A representation of the chip's internals. This is a composite of the various pieces. The second ferrite plate would go over the transformer coils. The dies are probably upside-down in the actual chip. The chip measures 7.5mm×10.3mm and 2.7mm thick.

The secondary die and its components

The chip contains two silicon dies, one for the primary-side circuitry that receives power and one for the secondary-side circuitry that outputs power. The photo below shows the silicon die for the secondary. The metal layer on top of the chip is visible; I think there are three metal layers in total to provide the chip's wiring. The chip's silicon is not visible in this photo as it is hidden under the metal. At the top and left, bond wires are connected to pads on the die. The left half of the chip is covered with a lot more metal than the right; the left side has the analog power electronics, so it needs high-current wiring.

The secondary-side die. Click for a larger image.

Removing the metal layers5 reveals the underlying silicon (below). This shows the transistors, resistors, and capacitors that make up the chip. There's not a lot of visual similarity between the metal layer and the underlying silicon, but a few of the features match up.

The secondary-side die with the metal removed.

One interesting feature of the chip is "CMP fill". During manufacturing, the layers of the chip were polished flat with Chemical-Mechanical Polishing (CMP). However, regions without any metal wiring are softer and would be polished down too much. To prevent this, empty regions are filled in with a grid of squares, ensuring that the chip is polished to a uniform level. The fill is visible in the photo below as the tiny square boxes at a slight angle. The chip has multiple layers of metal, and each layer has its own fill at a different angle. (The angle prevents the fill from aligning with other features, minimizing stray capacitance and inductance.)

The logo on the primary die, surrounded by CMP fill. The "P" in "UCP" indicates the primary.

At the bottom of the chip, underneath the metal layers, the silicon also has CMP fill, shown below. These raised fill squares are part of the silicon and the lines between the squares are filled with material, probably polysilicon. Note that although the grid is at an angle, each square is parallel with the chip. In other words, the positions of the squares are at an angle, but not the squares themselves.

The secondary silicon die, showing CMP fill surrounding some circuitry.

The diagram below labels some components of the die. The left side has the power components connected to the transformer, while the right side has the control logic.

The chip's logic appears to be built from two blocks of standard-cell circuitry, where each logic element is a fixed design from a library, and these cells are arranged on a grid. The photo below shows a closeup of the silicon implementing this logic. Each block is an MOS transistor, wired together by the metal layers that were on top. The smallest visible features are about 700 nm wide, the wavelength of red light. (This explains why the image is fuzzy.) In comparison, cutting-edge chips are now moving to a 5 nm process, 140 times smaller.

A closeup of standard-cell circuitry.

A large area of the chip consists of capacitors, which are constructed from a metal layer over the silicon, separated by dielectric. The large square regions in the photo below are capacitors; the dielectric appears yellowish, reddish, or greenish, depending on its thickness. These capacitors are connected together by the metal layer to form larger capacitors. (The tiny square pattern between the capacitors is CMP fill, discussed earlier.) I couldn't dissolve the dielectric, so I suspect it is silicon nitride, rather than the silicon dioxide that provides most of the insulation between the die's layers.

The die has numerous square capacitors.

The horizontal stripes in the silicon below are resistors, formed by doping silicon to produce regions with higher resistance. The resistance is proportional to the length divided by the width, so resistors are long and thin to obtain significant resistance. By connecting the resistor stripes at the ends in a zig-zag pattern, a high-value resistor can be produced.

These long stripes are presumably resistors.

The photo below shows some of the transistors on the chip. The chip uses a wide variety of transistors, ranging from the large power transistor at the bottom to the collection of tiny logic transistors to the left of the "10µm" label. All the transistors are shown at the same scale, so you can see the dramatic range in sizes. (There might be diodes in here too.)

A collection of transistors from the secondary die, all displayed at the same scale for comparison.

The primary die

The photo below shows the primary-side silicon die. Some of the bond wires are attached to the chip at the top. In this photo, some of the metal layer has been removed, showing the underlying wiring. The top side of the chip has the analog power circuitry, mainly capacitors, and it is covered with a mostly-uniform layer of metal.6

The primary-side die with some of the metal removed.

The closeup below shows the primary die midway through removal of the metal and oxide layers. Note that some metal and polysilcon pieces have come loose from the die and are at random angles. This illustrates how the die has a three-dimensional structure, with multiple layers on top of each other. With the oxide removed, the structures in a layer can fall off.

A closeup of the primary die with the metal partially removed.

How the chip works

The basic idea of the chip is straightforward; it operates as an isolated DC-DC converter. The primary side of the chip converts the input voltage into pulses that are fed into the transformer. The secondary side rectifies the pulses to produce the output voltage. Because there is no electrical connection between the primary and secondary—just the transformer—the output voltage is electrically isolated. However, the details are not documented: there are many possible "topologies" for generating and rectifying the pulses, such as a flyback converter, a forward converter, or a bridge converter. Another question is how the output voltage is controlled.7

I studied various TI patents, and I think the chip uses a technique called a "phase-shifted dual-active-bridge", shown below. The primary uses four transistors configured as an H-bridge (on the left) to send positive and negative pulses to the transformer (middle). A similar H-bridge on the secondary side (right) converts the transformer's output back to DC. The reason to use an H-bridge instead of diodes on the secondary side is that by changing the timing, more or less power gets transmitted. In other words, by shifting the phase between the primary's bridge and the secondary's bridge, the voltage can be regulated. (Unlike most converters, neither the pulse frequency nor the pulse width is modified in this approach.)

Diagram from patent 10122367, Isolated phase-shifted DC to DC converter.

Each H-bridge consists of four transistors: two N-channel MOS transistors and two P-channel MOS transistors. The photo below shows six large power transistors that take up a large fraction of the secondary die. Examining their structure, I think the two on the right are N-channel MOSFETs and the other four are P-channel MOSFETs. This would yield the four transistors required for the H-bridge, with two transistors left over for another purpose.

These large power transistors are on the left side of the secondary die photo.

Using the chip

I wired up the chip on a breadboard (below) and it worked as advertised. It's an extremely easy chip to use, just a couple of filter capacitors on the input and output. (While the dies contain numerous capacitors, they are much too small for filtering. External capacitors provide larger capacitances.) I put 5 volts in (lower left) and got 5 volts out (upper right), lighting an LED. When implementing power electronics, it is important to follow layout recommendations to avoid noise and oscillation. However, even though this breadboard did not satisfy any of these recommendations, the chip worked fine. I measured the output at 5 volts, with little noise.

The chip wired up on a breadboard. The chip is mounted on the breakout board in the middle, which allows it to be plugged into the breadboard.

Conclusion

When I saw a chip containing a complete DC-DC converter, I figured there must be some interesting technology inside. Decapping the chip revealed the components, including two silicon dies and tiny planar transformer windings. By studying the pieces and comparing with Texas Instrument patents, I concluded that the chip uses a phase-shifted dual-active-bridge topology for power transfer. (Interestingly, this topology is becoming popular for electric vehicle chargers, although at much higher power.8)

The dies are complex with three layers of metal and small features that can't be resolved optically. I usually examine chips that are decades older and much easier to understand, so this post has more speculation than my typical reverse-engineering. (In other words, I probably got some things wrong.) If you're familiar with modern IC components and recognize any components, please let me know.

I announce my latest blog posts on Twitter, so follow me @kenshirriff for future articles. I also have an RSS feed. Thanks to Robert Baruch for decapping this chip for me and thanks to Texas Instruments for supplying me with a free sample chip.

Notes and references

1. A lot of people complain about ad targeting, but in this case, the ad (below) was an exact match for my interests. This chip is the UCC12050; the datasheet is here.

   

   Texas Instruments' ad for the power transfer chip, showing how small the chip is.

    ↩

2. The chip can output 5V, 3.3V, 5.4V, or 3.7V, selectable by a resistor. The 5.4V and 3.7V values may seem random, but the motivation is they provide an extra 0.4V, allowing the voltage to be regulated by an LDO regulator. The chip doesn't provide a lot of power, just half a watt. ↩

3. Because of the internal structures in the chip, there is a risk of moisture penetrating the package and accumulating inside. When soldering the chip, this moisture could vaporize, causing the chip to pop like popcorn. To avoid this possibility, the chip was packaged in a special moisture-proof bag that contained moisture indication cards. The chip has moisture sensitivity level 3, indicating it must be soldered within a week of removal from the bag. If the chip exceeds the limit, it must be baked before soldering to drive out the residual moisture.

   ↩

   The moisture-proof bag that held the chip and the moisture indication cards.

4. It would be interesting to take a cross-section of this chip to see the exact internal layout, like the cross-sections done by @TubeTimeUS. ↩

5. To remove the layers from the chip, I alternated application of hydrochloric acid (pool acid) to dissolve the metal and application of Armour Etch to remove the silicon dioxide layer. ↩

6. I accidentally dropped the primary die down the drain while trying to clean it, so I don't have many pictures of the primary die. ↩

7. Controlling the output voltage in a DC-DC converter can be done in various ways. A common approach is to send feedback from the secondary side to the primary side through an optoisolator, allowing the primary side to adjust the voltage. In another approach, the primary side uses a separate transformer winding to monitor the voltage. Neither of these approaches seems possible with this chip, though: there's no feedback path from the secondary, but the output voltage is selected by the secondary. An inefficient approach would be to put a linear voltage regulator on the secondary side to drop the voltage to the desired value. ↩

8. I came across an interesting video that shows a dual-active-bridge converter for electric vehicle charging. This converter is powered directly from a 2.5-kilovolt power line, which is a bit scary. ↩

Inside the digital clock from a Soyuz spacecraft

We recently obtained a clock that flew on a Soyuz space mission.1 The clock, manufactured in 1984, is much more complex inside than you'd expect, with over 100 integrated circuits on ten circuit boards. In this blog post, I examine the clock's circuitry and find that it needed so many chips because it was implemented with simple TTL logic. The clock also provides a glimpse into the little-known world of Soviet aerospace electronics and how it compares to American technology.

"Onboard space clock" from a Soyuz mission. The clock provides the time, an alarm, and a stopwatch.

The Soyuz series of spacecraft was designed for the Soviet space program as part of the race to the Moon. Soyuz first flew in 1966 and has made more than 140 flights over the past 50 years. The spacecraft (below) consists of three parts. The round section on the left is the orbital or habitation module, holding cargo, equipment, and living space. The descent module in the middle is the only part that returns to Earth; the astronauts are seated in the descent module during launch and reentry. Finally, the service module on the right has the main engine, solar panels, and other systems.

Soyuz TMA-7 spacecraft departing from the International Space Station, 2006. Photo from NASA.

The descent module contains the spacecraft's control panel (below).2 Note the digital clock in the upper left. Early Soyuz spacecraft used an analog clock, but from 1996 to 2002, the spacecraft used a digital clock.3 The digital clock was also used in the Mir space station. The clock was eliminated from later Soyuz spacecraft, which used two computer screens on the control panel in place of the earlier controls.

Control panel from a Soyuz spacecraft. The digital clock is in the upper left of the panel. The screen in the middle is a TV monitor. Photo from Stanislav Kozlovskiy, CC BY-SA 4.0.

A closer look at the clock

The diagram below shows the clock's labels translated into English. The clock has three functions: the time, an alarm, and a stopwatch. The "Clock of Current Time"5 mode shows the current Moscow time on the six upper LED digits, while "Announcement" shows the alarm time. The alarm can be set to a particular time; at that time, the clock triggers a relay activating an external circuit in the spacecraft.4 The clock is set using the "Correction" mode; digits are incremented using the "Enter" button. The lower half of the unit is the stopwatch; the bottom four LEDs display elapsed minutes and seconds. The lower pushbutton stops, starts, or resets the stopwatch.6 Finally, the power switch at the right turns the clock on.

Front of the clock. The red text is the translation of the Russian labels into English.

We wanted to see what was inside the clock, of course, so Marc unscrewed the cover and removed it from the clock. This revealed a dense stack of circuit boards inside. The clock was much more complex than I expected, with ten circuit boards crammed full of surface-mount ICs and other components. The components are mounted on two-layer printed-circuit boards, a common construction technique. The boards use a mixture of through-hole components and surface-mount components. That is, components such as resistors and capacitors were mounted by inserting their leads through holes in the boards. The surface-mount integrated circuits, on the other hand, were soldered to pads on top of the board. This is more advanced than 1984-era American consumer electronics, which typically used larger through-hole integrated circuits and didn't move to surface-mount ICs until the late 1980s. (American aerospace computers, in contrast, had used surface-mount ICs since the 1960s.)

Space clock from Soyuz with the cover removed.

One interesting feature of the clock is that the boards are connected by individual wires that are bundled into wiring harnesses (below). (I expected the boards to plug into a backplane, or be connected by ribbon cables.) The boards have rows of pins along the sides, with wires soldered to these pins. These wires were gathered into bundles, wrapped in plastic, and then carefully laced into wiring harnesses that were tied to the boards.

The clock has point-to-point wires, wrapped into neat harnesses.

At first, we thought that further disassembly of the clock would be impossible without unsoldering all the wires, but then we realized that the wiring harnesses were designed so the boards could be opened like a book (see below). This allowed us to examine the boards more closely. Inconveniently, some pairs of boards were soldered together at the front by short wires, so we couldn't see both sides of these boards.

The wiring bundles are arranged so the boards can swing apart.

In the photo above, you can see the numerous integrated circuits in the clock. These are mostly 14-pin "flat pack" integrated circuits in metal packages, unlike contemporary American integrated circuits which were usually packaged in black epoxy. There are also some 16-pin integrated circuits, encased in pink ceramic.

The circuitry inside

The next step was to examine the circuitry in more detail, which I'll discuss starting at the back of the clock. A 19-pin connector7 linked the clock to the rest of the spacecraft. The spacecraft provided the clock with 28 volts through this connector, as well as external timing pulses and stopwatch control signals. The clock could signal the spacecraft through relay contacts when the alarm time was reached.

This 19-pin connector interfaces the clock to the spacecraft.

The two circuit boards at the back of the clock are the power supply, which was more complex than I expected. The first board (below) is a switching power supply that converts the spacecraft's 28-volt power to the 5 volts required by the integrated circuits. The round ceramic components are inductors, ranging from simple coils to complex 16-pin inductors. The control circuitry includes two op amps in metal can packages. Two other packages that look like integrated circuits each hold four transistors. Next to them, a bullet-shaped Zener diode sets the output voltage level. The large round switching power transistor is visible in the middle of the board. You might expect the power supply to be a simple buck converter. However, the power supply uses a more complicated design to provide electrical isolation between the spacecraft and the clock. I'm not sure, though, why isolation was necessary.8

Board 1 implements a switching power supply to produce 5 volts for the clock.

Many of the components in the power supply look different from American components. While American resistors are usually labeled with colored bands, the Soviet resistors are green cylinders with their values printed on them. The Soviet diodes have orange rectangular packages (below), unlike the usual cylindrical American diodes. The power transistor in the middle of the board is round, lacking the metal flanges of American power transistors in "TO-3" packages. I don't think the Soviet packaging is better or worse, but it's interesting to see how components from the two countries diverged.

The power supply uses 1 amp diodes in rectangular orange packages. The "OC" indicates a higher-quality military part.

The second board is also part of the power supply, but is much simpler. It has inductors and capacitors to filter the power, as well as a linear voltage regulator chip (pink) to produce 15 volts for the op amp ICs in the first board. The voltage regulator chip has two large metal tabs on the bottom that were soldered to the circuit board to dissipate heat. Strangely, the board has three large holes in the right side. The obvious explanation would be that these holes made room for tall components, a situation that arises on another board. However, there are no components that fit the holes on this board. Thus, I suspect this board was originally designed for a different device and reused in the clock.

Power supply board 2 is half-empty, with the right half apparently acting as a heat sink.

The remaining boards are filled with digital logic integrated circuits. Board 3 (below) and board 5 (which is similar) implement the current time and alarm time functions. Each board contains six BCD counter chips for the six digits (hours, minutes, and seconds).9 In addition, each digit counter requires a logic chip to control when it is incremented and another chip to control when it is reset, depending on whether the clock is being set or is running. (This is one reason why so many chips are required.) The pink chip on the board controls which digit is modified when setting the clock.10

Board 3 is filled with digital logic integrated circuits. Pins on either side connect the board to the wiring harnesses.

Board 4 (below) has two functions. First, it controls whether the clock displays the current time or the alarm time. This is implemented with a selection chip for each digit. Second, the board signals the spacecraft when the current time reaches the alarm time. This is implemented with multiple chips to step through each digit, compare the times, and determine if they match. Thus, even though the functions of this board seem simple, they require a whole board of chips. The connections at the bottom of the board link board 4 to board 5. The board is connected to board 3 through the wiring harness.

Board 4 selects between the current time and the alarm time. It also compares the two values to determine when the alarm time has been reached.

Some of the boards have more circuitry than just digital logic. For instance, boards 6 and 7 have pulse transformers to electrically isolate the control signals fed into the clock through the 19-pin connector. (In modern circuits, this role would be performed by an optoisolator.) These transformers look a bit like mushrooms or miniature water towers, and can be seen in the photo below. Board 7 also has a quartz crystal, the metal rectangle below.11

Board 7 has a 1 MHz crystal that provides the timing signals for the clock. It also has three round pulse transformers that isolate the control signals from the spacecraft.

The two functions of board 7 (below) are to generate the clock's timing pulses and to implement the stopwatch. The quartz crystal generates accurate 1 megahertz pulses. These pulses are reduced to one-second pulses by six BCD counters; each counter chip divides the frequency by 10. These timing pulses are used by the rest of the clock. To implement the stopwatch, the board has four BCD counters for the four digits. It also has control logic to start, stop, and reset the stopwatch. The three pulse transformers allow the spacecraft to control the stopwatch when certain events happen. Additional chips handle these mode changes.

Board 7 contains the stopwatch circuitry, as well as the quartz crystal that generates timings for the whole clock. Wires along the front connect the board to Board 6.

Boards eight and nine drive the LED displays. Each LED digit requires a chip to illuminates the appropriate segments of the 7-segment LED based on the BCD (binary-coded decimal) value. These BCD-to-7-segment driver chips are the pink 16-pin chips on the board.12 Since the clock displays 10 digits in total, 10 driver chips are used. Eight driver chips are on board 8, while board 9 has two chips along with numerous current-limiting resistors for the LEDs. The switches to control the clock are also visible in the photo below.

Board 8 is an LED driver board holding eight 7-segment driver chips. Board 9 (underneath) has two more driver chips and many resistors.

Finally, board 10 (below) holds the ten LED digits. Each digit consists of a seven-segment LED, along with a comma. I think one of the commas is wired up to indicate something; we'll find out what when we power up the clock.

Board 10 holds the ten LED digits. Photo from Marc Verdiell.

Soviet integrated circuits

Next, I'll discuss the integrated circuits used in the clock. The clock is built mostly from TTL integrated circuits, a type of digital logic that was popular in the 1970s through the 1990s. (If you've done hobbyist digital electronics, you probably know the 7400-series of TTL chips.) TTL chips were fast, inexpensive and reliable. Their main drawback, however, was that a TTL chip didn't contain much functionality. A basic TTL chip contained just a few logic gates, such as 4 NAND gates or 6 inverters, while a more complex TTL chip implemented a functional unit such as a 4-bit counter. Eventually, TTL lost out to CMOS chips (the chips in modern computers), which use much less power and are much denser.

Because each chip in the Soyuz clock didn't do very much, the clock required many boards of chips to perform its functions. For example, each digit of the clock requires a counter chip, as well as a couple of logic chips to increment and clear that digit as needed, and a chip to drive the associated 7-segment LED display. Since the clock displays 10 digits, that's 40 chips already. Additional chips handle the buttons and switches, implement the alarm, keep track of the stopwatch state, run the oscillator, and so forth, pushing the total to over 100 chips.

One nice thing about Soviet ICs is that the part numbers are assigned according to a rational system, unlike the essentially random numbering of American integrated circuits.13 Two letters in the part number indicate the function of the chip, such as a logic gate, counter, flip flop, or decoder. For example, the IC below is labeled "Δ134 ΛБ2A". The series number, 134, indicates the chip is a low-power TTL chip. The "Л" (L) indicates a logic chip (Логические), with "ЛБ" indicating NAND/NOR logic gates. Finally, "2" indicates a specific chip in the ЛБ category. (The 134ЛБ2 chip's functionality is two 4-input NAND gates and an inverter, a chip that doesn't have an American counterpart.) 14

Two integrated circuits inside the clock.

The logos on the integrated circuits reveal that they were manufactured by a variety of companies. Some of the chips in the clock are shown below, along with the name of the manufacturer and its English translation. More information on Soviet semiconductor logos can be found here and here.

By looking up the logo on each chip, the manufacturer can be determined.

Comparison with US technology

How does the Soyuz clock compare with US technology? When I first looked at the clock I would have guessed it was manufactured in 1969, not 1984, based on the construction and the large number of simple flat-pack chips. In comparison, American technology in 1984 produced the IBM PC/AT and the Apple Macintosh. It seemed absurd for the clock to use boards full of TTL chips a decade after the US had produced single-chip digital watches.16 However, the comparison turned out to be not so simple.

To compare the Soyuz clock with contemporary 1980s American space electronics, I looked at a board from the Space Shuttle's AP-101S computer.17 The photo below shows circuitry from the Soyuz clock (left) and the Shuttle computer (right). Although the Shuttle computer is technologically more advanced, the gap was smaller than I expected. Both systems were built from TTL chips, although the Shuttle computer used a faster generation of chips. Many Shuttle chips are slightly more complex; note the larger 20-pin chips at the top of the board. The large white chip is significantly more complex; it is an AMD Am2960 memory error correction chip. The Shuttle's printed-circuit board is more advanced, with multiple layers rather than two layers, allowing the chips to be packed 50% more densely. At the time, the USSR was estimated to be about 8 to 9 years behind the West in integrated circuit technology;15 this is in line with the differences I see between the two boards.

The Soyuz clock board (left) and Space Shuttle computer board (right), to the same scale. Both use surface-mount TTL chips.

What surprised me, though, was the similarities between the Shuttle computer and the Soviet clock. I expected the Shuttle computer to use 1980s microprocessors and be a generation ahead of the Soyuz clock, but instead the two systems both use TTL technology, and in many cases chips with almost identical functionality. For example, both boards use chips that implement four NAND gates. (See if you can find the 134ΛБ1A chip on the left and the 54F00 on the right.)

Conclusion

Why does the Soyuz clock contain over 100 chips instead of being implemented with a single clock chip? Soviet integrated circuit technology was about 8 years behind American technology and TTL chips were a reasonable choice at the time, even in the US. Since each TTL chip doesn't do very much, it takes boards full of chips to implement even something simple like a clock.

The next step will be to power up the clock and see the clock in operation. I've been studying the power supply so we can make this happen. I plan to write more about the power supply and other parts of the clock, so follow me @kenshirriff for details. also have an RSS feed. Until then, you can watch Marc's video showing the disassembly of the space clock:

Notes and References

1. CuriousMarc obtained the clock from an auction and it was advertised as flown to space, but I don't know which mission it was flown on. The date codes on the components inside the clock are mostly from 1983, with one from 1984, so the clock was probably manufactured in 1984. The Russian name for the clock is "Бортовые Часы Космические" (Onboard Space Clock), which is abbreviated as "БЧК". ↩

2. The photo of the Soyuz console was mislabeled as from Soyuz 7K-VI. However, that mission was in the 1960s and the Soyuz-7K console was much different. A photo of the Soyuz-7K console is in this Russian article. ↩

3. The digital clock was used in the Soyuz-TM version of the spacecraft. This version of the console was known as Neptune (Нептун). For details on Soyuz consoles, see The Integrated Information Display System for the Soyuz-TMA. Two Russian documents are this and (this. The analog clock can be seen in a Scott Manley video here and in some photos by Steve Jurvetson. ↩

4. Most of the description of how the clock works is based on my reverse engineering, so I don't guarantee that everything in this post is accurate. When we power up the clock, I'll find out what I got wrong :-) ↩

5. The clock has the label "ЧТВ", which is an abbreviation for "Часы Текущего Времени". The Soyuz Crew Ops Manual translates this as "Clock of Current Time". ↩

6. The Soyuz Crew Ops Manual has some information on the clock on page 35. According to the manual, the stopwatch is controlled automatically during the propulsion system engine burn timing, to measure the time between the Engine Fire command and the Engine Cut Off command. It also automatically measures the time during descent until contact. ↩

7. The 19-pin connector was a standard Soviet military connector of type RS19TV (РС19ТВ in Cyrillic). I was able to find a matching connector on eBay, which we will use for powering the clock. ↩

8. Cell-phone chargers, for instance, use isolated power supplies for safety, to protect the user from the dangerous 120-volt line voltage. The clock, however, is powered with 28 volts, so there's no obvious reason for electrical isolation. (The Apollo Guidance Computer's power supply, for example, used a non-isolated switching power supply.) ↩

9. The clock uses a BCD counter chip for each digit with some exceptions. The top hours digit only goes to "2" (for a 24-hour clock), so two flip flops are used instead of a counter. The top digit for minutes and seconds needs to roll over at 6 (i.e. 60 seconds/minutes), so the clock uses a divide-by-12 chip similar to the 7492 chip. (The chip can be configured to roll over at 6 rather than 12.) ↩

10. The pink chip on board 3 is a К134ИД6 decimal decoder, which selects one of 10 outputs based on the 4-bit BCD value fed into it. (The part number ИД indicates a decoder, Дешифраторы.) This chip is a copy of the American 74L42 chip. For some reason, the 16-pin integrated circuits are in pink ceramic packages, while the more common 14-pin integrated circuits are in metal packages. ↩

11. The Soyuz Crew Ops Manual (page 35) specifies the clock's accuracy as 30 seconds per day, which isn't very good. In comparison, a low-cost Timex quartz watch from the early 1970s was accurate within 15 seconds per month. According to the manual, the clock could be synchronized to external time pulses. During launch/injection and autonomous orbital flight phases, the clock was synchronized to the Program-Timing Control Equipment (АПВУ). It could also be synchronized to the TV unit (KЛ110). ↩

12. LED displays often use multiplexing, where one driver chip is shared across all the digits and the display rapidly cycles through the digits. This reduces the number of chips and resistors required. I'm not sure why the clock uses separate drivers instead of multiplexing. ↩

13. For more information on Soviet integrated circuits, including the ones used in the clock, see the databook Интегральные микросхемы и их зарубежные аналоги (Integrated circuits and their foreign counterparts). ↩

14. The Soviet IC designation system is described in detail on Wikipedia. There are a few complications that make a chip's designation different from the labels printed on the chip. Because Л and П (Cyrillic L and P) look similar on small chips, the chip labels use Λ (Greek L) in place of Л (Cyrillic L). The Greek D (Δ) may replace Cyrillic D (Д) to avoid confusion with Cyrillic А. Moreover, names for commercial chips start with K, unlike the military chips used in the clock. Thus, a chip labeled "Δ134 ΛБ2A" appears in databooks and on the web under the name "К134ЛБ2". ↩

15. Two CIA reports (1974 and 1986) provide information on the lag between Soviet IC technology and Western technology. ↩

16. US manufacturers implemented clocks on a single chip in the early 1970s. Mostek introduced a single-chip digital clock chip in 1972, the Mostek MM5017. In 1974, Intel introduced a watch using a low-power CMOS chip, the Intel 5810 In other words, the Soyuz clock could (roughly) have been replaced with a single chip a decade earlier. ↩

17. The AP-101S computer in the Space Shuttle was part of IBM's System/4π line of avionics computers. This 64-pound computer was built from TTL integrated circuits, using the 74F00 series (Fairchild's FAST line) for improved performance. (Its memory, however, was built from high-capacity CMOS chips.) The AP-101S computer was an updated version of the AP-101B used in the earlier Space Shuttle flights. (See The new AP101S general-purpose computer (GPC) for the space shuttle and Space Shuttle Avionics Upgrade.)

    At first, it surprised me that they designed both Shuttle computers from low-complexity TTL chips, but it made sense when the design of the earlier AP-101B computer started in 1972. Back in the 1970s, minicomputers were commonly built from TTL chips because microprocessors were new and much slower than TTL. The first Shuttle computer achieved a speed of 0.42 MIPS. This performance was respectable in 1972 but poor by 1981, when the Shuttle first flew.

    To improve performance, a redesign of the computer started in 1982. The updated AP-101S computer stuck with TTL, so its performance improved only moderately, to 1.27 MIPS, slightly slower than the Motorola 68010 (1982) which ran at 2.4 MIPS. Unfortunately, the gap between TTL computers and microcomputers got exponentially worse, following Moore's law. By 1991, when the AP-101S first flew, the Motorola 68040 ran at 44 MIPS. And by the end of the Shuttle program in 2011, the Intel Core i7 processor ran at 100,000 MIPS, many orders of magnitude faster than the Shuttle computer.

    So why did the Space Shuttle use mostly-obsolete TTL technology in the 1980s redesign? One reason was backward compatibility. Since the first Shuttle computer used the proprietary IBM 4π architecture, it couldn't be replaced by an off-the-shelf microprocessor. Reliability was another motivation for TTL. Commerical microprocessors weren't designed for the reliability needs of space systems and lacked features such as radiation resistance and parity-protected caches. Finally, the aerospace development cycle is very long; although the Shuttle computer redesign started in 1982, the computer wasn't used on a flight until 1991 and remained in use until 2011. The point is that there were reasons to build aerospace systems from TTL, even though microprocessors were much faster, more compact, and lower power. ↩